Silicone Wafer Doping Machine

To solve a problem which occurs when silica dust is sprayed on the surface of a silicon wafer at high speed

This system was commissioned by the customer to solve a problem which occurs when silica dust is sprayed on the surface of a silicon wafer at high speed.  On each pass the layer of dust is slightly mounded causing uneven deposition.  This problem is caused by vibration in the structure, to overcome this Micromech produced a system from rigid aluminium extrusion, with Hauser HLE series actuators and microstepping motors which gave the control and speeds required.
The system is controlled by a 6K indexer, linked to a PC with bespoke visual basic front-end.